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IBM J. Res. , 32 (5): 647–657, 1988. 5. com/ tmo/hpeeof. 6. T. , Darmstadt, January 1994. 7. , Pittsburgh, 1995. 8. W. J. R. Hoefer and P. So, The Electromagnetic Wave Simulator, New York: Wiley, 1991. 9. H. Hasegawa, M. Furukawa, and H. Yanai, Properties of microstrip line on SiSiO2 system, IEEE Trans. Microw. , MTT-19: 869–881, 1971. 10. K. Reiss and O. Palusinski, Procedure for direct calculation of characteristic admittance matrix of coupled transmission lines, IEEE Trans. Microw. , 44: 152–154, 1996.

FORMULATION PRINCIPLES The formulator’s task is to minimize viscosity to facilitate molding, while simultaneously optimizing the cured encapsulant properties. When cured, most desirable encapsulation properties come from the filler. It reduces the cost, thermal expansion coefficient (TCE), and moisture absorption while increasing the thermal conductivity, electrical resistance, strength, and impact resistance. Before cure the monomeric epoxy and hardener resins provide the liquidity needed to fill the mold cavities.

To emphasize this difference, they are sometimes called Maxwell capacitances. The structure inductances are computed using the fact that the product of inductance and capacitance matrices for the same conductor structure formed in vacuum satisfies the relation LC0 ϭ (1/ ␯2)E, where C0 is the capacitance matrix computed under the assumptions that all dielectric constants are unity (this corresponds to the replacement of dielectrics by vacuum), ␯ is the velocity of light in vacuum, and E is the unity matrix.

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11.Components, Packaging, and Manufacturing Technology by John G. Webster (Editor)

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